I applied online. I interviewed at TSMC (Philadelphia, PA) in Dec 2020
Interview
Contacted by recruiter to set up interview within 2 weeks. 1st round with 3 managers and 1 HR in Taiwan for 1 hour. They reverted back in 8 days and scheduled the 2nd round with the Director of Fab in Taiwan for 30 minutes. I got the offer within 10 days of the 2nd round.
Interview questions [1]
Question 1
They basically asked about my resume and my experience with certain tools and methods and a little about my device fabrication and characterization experience. All of the questions were very basic and they did not cross question much. They later asked questions related to conflicts with teammates, time-management, and if I am willing to go to Taiwan for training.
Both interviews on Teams. First interview 30 minutes standard questions on conflict. Second interview mostly about experience from resume and why you want to work at the company. Straight forward interview.
I applied through an employee referral. The process took 2 weeks. I interviewed at TSMC (Phoenix, AZ) in Jan 2026
Interview
Self Introduction for 5 minutes at first. Then they asked behavioral questions for 25 minutes. Then asked technical questions for 10 minutes. They mainly care about whether you are familiar with semiconductor device knowledge and fabrication process.
Ask academy background. If you can follow company’s strategy to relocate. Willing to do overtime since it’s gonna happened frequently. Overall it’s not too harsh. The point of the interview to check the personality more than your ability. Just to make sure you can get your job done under high pressure.
Interview questions [1]
Question 1
Would your willing to relocate if company ask you to.
