Description

Key Responsibilities

• Develop and optimise wet etch and/or dry etch processes for MicroLED fabrication.
• Define etch recipes for IIIV materials.
• Optimise critical parameters including etch rate, selectivity, anisotropy, sidewall angle, surface roughness, and uniformity.
• Support pixel scaling while maintaining yield and device performance.
• Perform process qualification, tool matching, and SPC control.
• Troubleshoot process excursions, defects, and yield loss related to etch steps.
• Analyse etch results using SEM, AFM, profilometry, ellipsometry, and optical inspection.
• Conduct DOE experiments to improve process robustness and manufacturability.
• Drive defect reduction initiatives related to etch damage, residues, and sidewall passivation.
• Work closely with lithography, epitaxy, CMP & integration engineers, support engineering teams with etch-related design feedback.

Skills, Knowledge and Expertise

• Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
• 3+ years of hands-on experience in wet etch and/or dry etch process engineering (semiconductor or display industry).
• Strong understanding of plasma etching physics and/or wet chemical etch mechanisms.
Direct experience with MicroLED or LED fabrication and/or IIIV materials would be an advantage.

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Benefits

• Pension scheme
• Private medical & dental insurance
• 28 days’ holiday + bank holidays
• Free onsite meals
• Onsite gym
• Relocation support
• Visa support available

About Plessey Semiconductors