3 rounds took place one after other on different days - 1>Written(20 marks paper,digital questions,logic building and analytical questions/quizz) 2>Technical (1-1, Interview on concepts of digital circuits,devices) For many of us, there were 2 rounds of technical 3>HR (future goals, regular questions on future training programs, presentation skills on a small technical topic, reason of choosing the company over other companies, discussion on the bond)