RAM Innovations is a small but fast-growing business at the forefront of developing advanced packaging techniques for the semiconductor industry. Situated on Deeside in North Wales, a ten-minute drive West from the historic city of Chester, the business is in the process of transitioning from a niche R&D business to a manufacturing-oriented business underpinned by a strong R&D base.

RAM has developed a world leading process to embed bare semiconductor dies directly into printed circuit boards, enabling both significant improvements in efficiency and a reduction in the size and weight of power electronics modules. As the world continues its transition towards Net-Zero, smaller and more efficient power electronics are an essential building block to the electrification of all types of transport and many industrial processes.

RAM is already collaborating with a number of aerospace and automotive OEMs and Tier 1 suppliers to develop and manufacture hardware on a commercial basis. We are also continuing to invest in R&D through grant funded collaborations with partners including the Compound Semiconductor Applications Catapult.

We are actively recruiting to expand the team and are looking for people with a strong technical mindset, who are willing to work with teammates, customers and partners to find solutions and drive the business forward. We have a number of positions opening up in the near future and are interested in hearing from potential colleagues with a broad spectrum of technical experience, ranging from seasoned senior technology leaders, to aspiring junior engineers.

Qualifications

We are looking for people who have achieved a minimum of HNC or degree level qualifications through education or time served experience. Educational experience within some of the following fields is of particular interest:

• Mechanical engineering

• Product development

• Electrochemistry

• Process engineering

• Chemical engineering

• Electronics

• Manufacturing

Experience

In terms of work experience, we are looking for people who are interested in building on their existing skills to develop deep domain knowledge across a number of elements of RAM’s process capabilities. Previous experience of some of the following areas is required:

• 3D CAD modelling

• PCB manufacturing

• New product introduction processes

• Design for manufacturing

• Use of Gerber files and PCB layout software (Altium)

• Electronics manufacturing

• Material selection

• Manufacturing processes involving chemical and electrochemical processes

• IPC standards relevant to PCB/PCBA design and manufacturing

• Report writing

• Low to mid-volume electromechanical design, assembly and test

• Interaction with customers and partners through R&D projects

Join us!

• We need team members to be ‘hands on’ and most roles will be a mix of office and lab/shopfloor activities

• We are delivery focused and will only achieve our potential if we follow through on our commitments to our customers and partners

• We are a flexible working employer and are currently experimenting with a 4-day week for manufacturing activities

• As a business that will grow rapidly over the next few years, there will be plenty of opportunities for career development and we will support with funding third party training as required

• Most of all, we are offering team members the opportunity to help build a dynamic UK engineering and manufacturing business that can help accelerate the transition to Net-Zero

Please send CV and covering letter to: jobs@ram-innovations.com